Call for Papers

Call for Papers

Inaugural Issue

Journal of Digital Engineering and Innovation

Gold OA Issues 1–5: Free APC From Issue 6: 90–180 USD 50% Outstanding Paper Waivers

Inaugural Issue

March 2027

Journal of Digital Engineering and Innovation (JDEI) is now accepting submissions. The journal is a peer‑reviewed, Gold Open Access publication by StarNexus Science Press (Hong Kong).

Aims & Scope — Core Areas

Digital Twins & Simulation
AI-Driven Engineering Design
Digital Manufacturing & Industry 4.0
Cyber-Physical Systems
Innovation & Technology Management
Smart Infrastructure & Urban Systems

Inaugural Special Offer (Issues 1–5)

  • APC for Issues 1–5: Complete APC waiver (Free) for all accepted manuscripts.
  • Standard Rate (From Issue 6): Students: 90 USD | Faculty: 180 USD.
  • Free print sample copy: A complimentary hardbound print copy will be provided. Authors must fill in the sample copy request form after acceptance to arrange delivery.
  • 50% Outstanding Paper waivers: 50% of accepted articles will be selected for full APC waivers based on editorial assessment.

Submission Types

Research Articles
6,000–10,000 words
Review Articles
8,000–15,000 words
Technical Notes
2,000–4,000 words

Key Dates

Submission Deadline
January 30, 2027
First Notification
Within 14 days
Publication
March 2027

Author Resources

All files are compliant with JDEI submission guidelines.

Editor-in-Chief

Position open – currently recruiting
We are actively seeking a distinguished scholar to serve as Editor-in-Chief for JDEI.
If you are interested, please contact the editorial office at jdei@starnexus.press.

Executive Editors

Qiaolei Jiang
Tsinghua University, China
Qiong Sun
Beijing Union University, China

Associate Editors

Meiyu Zhou
East China University of Science and Technology, China
j j Sylvia IV
Fitchburg State University, USA
Qiuru Huang
Jiangnan University, China
Keung Hung
The Education University of Hong Kong
Tiance Dong
Chongqing University, China

Submit Your Manuscript via the Journal of Digital Engineering and Innovation website.